Deep Material’s EC products provide superior thermal performance, targeting a wide range of electronic applications such as handsets, tablets, laptop computers, and more. These solutions help mitigate heat buildup and enhance reliability in electronic devices.
Deep Material's EC products are designed to replace traditional FoF (Foam on Fabric) materials. These solutions offer enhanced thermal conductivity, high durability, and excellent reworkability, making them ideal for electronics and automotive applications.
| Property | TPGF-180 EC (Two Part EC Gel) | GFTP-180 EC (Thermal Pad) | Testing Method |
|---|---|---|---|
| Color | Black | Black | Visual |
| Mixing Ratio | 1:1 | - | - |
| Viscosity (cps) | 200,000 | - | ASTM D2196 |
| Density (g/cc) | 2.0 | 2.0 | ASTM D792 |
| Hardness (Shore 00) | 60 (after fully cured) | 65 | ASTM D2240 |
| Minimum BLT (mm) | 0.2 | - | - |
| Operation Temperature (°C) | -60 to 180 | -60 to 180 | - |
| Volatility (%) | < 0.1% | - | ASTM E595 |
| Electrical Parameters | |||
| Resistivity (ohm-cm) | 1 | 1 | Four-point probe |
| Flammability Rating | V-0 | V-0 | UL94 |
| Thermal Performance | |||
| Thermal Conductivity (W/m·K) | 1.5 | 1.5 | ASTM D5470 |
| Curing Parameters | |||
| Operation Time @ 25°C (min) | 60 | - | - |
| Curing Time @ 25°C (Hrs) | 4 | - | - |
| Curing Time @ 100°C (min) | 10 | - | - |
The TPGF-180 EC is a two-part EC gel formulated for superior thermal performance and electrical insulation. This product ensures efficient heat transfer and is reworkable, making it a perfect choice for high-performance electronics.
The GFTP-180 EC thermal pad provides high thermal conductivity and flexibility, suitable for various applications requiring solid thermal interfaces. It ensures efficient heat dissipation between heat-generating components and heat sinks or housings.