Deep Inside AI

The Materials Behind AI Performance

From enterprise SSDs to next-generation AI accelerators, Deep Materials delivers the thermal solutions that enable higher compute density, lower operating temperatures, and greater system reliability.

One Company. Every Thermal Interface.

FlexiMetal™

Metallic TIM performance without liquid-metal migration, shorting, or process-control risk.

High-Rebound Pads

Designed for memory, SSDs, and mechanically challenging applications.

Low-Oil Thermal Gels

Industry-leading solutions for enterprise SSDs and high-reliability electronics.

Advanced Thermal Materials

Greases, gap fillers, PCMs, and custom-engineered solutions for AI infrastructure.

Why AI Leaders Choose Deep Materials

  • Proven at hyperscale
  • Global manufacturing footprint
  • Engineering support from concept through production
  • Next-generation metallic TIM technology

Our technologies are deployed in millions of devices powering the world's most demanding compute environments.

Trusted Where Heat Matters Most

Deep Materials is a leading provider of advanced thermal interface materials for:

  • AI Accelerators
  • Enterprise SSDs
  • High-Performance Servers
  • Liquid-Cooled Systems
  • Networking and Optical Modules

Thermal Materials
Engineered for Performance

Your trusted thermal solution partner - managing heat dissipation in modern electronics since 2019

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Explore Flagship FlexiMetal 35 W/mK
2010
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Our Product Portfolio

Comprehensive thermal management solutions for every application

Thermal Grease

Thermal Grease

High-performance thermal grease for heat transfer between heat-generating components and heat sinks in modern electronics.

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PCM

PCM

PCM is up to 9.6 W/m·K phase change material supplied solid for simplified handling and assembly, which transitions near 50°C to improve surface wetting, reduce thermal impedance, and limit pump-out/migration for long-term reliability.

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FlexiMetal

Up to 35 W/mK materials with minimal bond line thickness for the most demanding thermal interface applications. FlexiMetal is available in foils for hand placement or in bulk for screen printing. FlexiMetal has all the advantages of liquid metal but without any of its drawbacks. Extensive performance and reliability data is available upon request.

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High Conductivity Adhesive Tape

High Conductivity Adhesive Tape

High Conductivity Adhesive tapes designed to provide efficient heat transfer and reliable bonding between heat-generating components and heat sinks. HCA materials combine thermally conductive, electrically insulating fillers with a low-modulus, silicone-free, low-oil-bleed formulation for clean adhesive-based thermal interfaces.

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Single Part Liquid Gap Filler

Single Part Liquid Gap Filler

Thermally conductive gap fillers for reliable heat transfer in compact devices. Available in low-oil-bleed, low-outgassing, high-flow, low-permittivity, and EMI-absorbing variants. Compatible with automated dispensing systems.

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Two Parts Liquid Gap Filler

Two Parts Liquid Gap Filler

Thermally conductive two-part gap fillers for efficient heat dissipation in demanding electronic assemblies. Available in ultra-thin bond-line, low-resistivity, EMI-absorbing, low-density, reworkable, and glass-bead-controlled variants. Compatible with automated dispensing systems. Custom formulations available.

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Whitepapers

PDF WhitepaperFlexiMetal Performance and Reliability TestingTesting across thermal test vehicles, notebooks and a 1,000 W liquid-cooling platform showed FlexiMetal combining low thermal resistance with strong long-term stability. Versus CryoFuze 7 grease, it reduced maximum surface temperature by up to 6.5% and average thermal resistance by up to 11%, with negligible degradation after nearly 10,000 power cycles. It also remained stable through 1,000 hours at 85°C/85% RH and more than 1,600 hours at 150°C—supporting demanding CPU, GPU and AI-accelerator applications.Read whitepaper→Peer-reviewed studyFlexiMetal for 1 kW Direct-to-Chip CoolingIn peer-reviewed 1,000 W cold-plate testing, Deep Materials’ FlexiMetal reduced critical heater temperatures by up to 6.5% and thermal resistance by up to 11% versus the thermal grease tested, while improving the apparent heat-transfer coefficient by up to 15%. The results demonstrate the potential of metallic TIMs for next-generation AI, GPU and data-center cooling.Read the study→PDF WhitepaperLow-Oil-Seepage Thermal Gels for EDSFF Enterprise SSDsAI-driven enterprise SSD demand is making thermal-material application a manufacturing bottleneck. Deep Materials’ patented, single-part thermal gels eliminate cure stations, restrictive assembly windows and difficult rework while offering thermal conductivity up to 6 W/m·K. With ten times less oil migration than conventional single-part gels, they can be automatically dispensed or screen-printed across more than 30 locations in one shot—creating a scalable path to faster, cleaner and more reliable EDSFF SSD assembly.Read whitepaper→

Industries We Serve

Consumer Electronics

Thermal interface materials for smartphones, laptops, gaming consoles, and wearable devices.

Automotive & EV

Battery thermal management, power electronics cooling, and ADAS system heat dissipation for electric vehicles.

Data Centers

High-performance cooling solutions for server racks, GPUs, and networking equipment in hyperscale facilities.

Aerospace & Defense

Reliable thermal management for avionics, radar systems, and mission-critical defense electronics.

Telecommunications

Thermal solutions for 5G base stations, network switches, and fiber optic transceivers.

AI Infrastructure

Thermal solutions for AI factories, accelerated computing, liquid cooling, and high-density compute platforms.

Get in Touch

Have a question about thermal performance, materials, or integration? Our applications engineering team can help you choose the right solution.

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