Deep Material's gap pads provide flexible, high-performance thermal solutions for various electronic devices requiring effective heat dissipation.
Gap pads are soft, conformable materials designed to bridge gaps between electronic components and heat sinks. They offer excellent thermal conductivity while compensating for surface irregularities, ensuring a solid thermal interface between heat-generating components and cooling systems.
| Property | GFTP-200T | GFTP-200 | GFTP-300 | GFTP-500 | GFTP-600 | GFTP-800 | GFTP-1000 | GFTP-1200 | GFTP-1500 | Testing Method |
|---|---|---|---|---|---|---|---|---|---|---|
| Color | White + Grey | Light Grey | Light Blue | Green | Grey | Dark Grey | Grey | Grey | Grey | Visual |
| Thickness (mm) | 0.5~10.0 | 0.5~10.0 | 0.5~10.0 | 0.5~10.0 | 0.5~10.0 | 0.5~10.0 | 0.5-4.0 | 0.5-4.0 | 0.5-4.0 | - |
| Density (g/cc) | 2.0 | 2.8 | 2.9 | 3.1 | 3.2 | 3.3 | 3.6 | 3.6 | 3.6 | ASTM D792 |
| Hardness (Shore 00) | 30 | 30 | 45 | 50 | 55 | 55 | 55 | 55 | 65 | ASTM D2240 |
| Operation Temperature (°C) | -50~200 | -50~200 | -50~200 | -50~200 | -50~200 | -50~200 | -50~200 | -50~200 | -50~200 | - |
| Electrical Parameters | ||||||||||
| Dielectric Constant @1GHz | 5.7 | 6.5 | 6.8 | 7.3 | 7.7 | 8.1 | 9.9 | 9.9 | 10.5 | ASTM D150 |
| Volume Resistance (Ω.cm) | 1015 | 1013 | 1013 | 1013 | 1013 | 1013 | 1013 | 1013 | 1013 | ASTM D257 |
| Breakdown Voltage (KV/mm) | >10 | >10 | >10 | >10 | >10 | >10 | >10 | >10 | >10 | ASTM D149 |
| Flammability Rating | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | UL 94 |
| Thermal Performance | ||||||||||
| Thermal Conductivity (W/m-K) | 2.0 | 2.0 | 3.0 | 5.0 | 6.0 | 8.0 | 10.0 | 12.0 | 15.0 | ASTM D5470 |
GFTP-200T offers a thermal conductivity of 2.0 W/m-K and is ideal for filling gaps in consumer electronics. It is a soft, flexible pad with a low hardness of 30 Shore 00, making it easy to compress between surfaces, enhancing the thermal interface.
Similar to the GFTP-200T, the GFTP-200 also has a thermal conductivity of 2.0 W/m-K. It is designed for applications where higher density (2.8 g/cc) and improved dielectric performance are required, making it suitable for industrial and automotive electronics.
With a thermal conductivity of 3.0 W/m-K, GFTP-300 is ideal for telecommunications and networking devices. Its Shore 00 hardness of 45 allows it to fill gaps effectively, while its electrical insulation properties ensure safety in sensitive electronic components.
GFTP-500 offers a thermal conductivity of 5.0 W/m-K, designed for high-power electronic modules where efficient heat dissipation is critical. It maintains its performance in temperatures ranging from -50°C to 200°C, ensuring reliable operation in harsh environments.
With an increased thermal conductivity of 6.0 W/m-K, GFTP-600 is designed for high-performance applications, such as battery management systems in electric vehicles. Its 55 Shore 00 hardness makes it flexible enough to conform to irregular surfaces while providing solid thermal performance.
GFTP-800 offers even higher thermal conductivity at 8.0 W/m-K, making it ideal for use in power electronics and LED lighting modules where substantial heat is generated. Its high dielectric constant provides excellent insulation, reducing the risk of electrical interference.
GFTP-1000, with a thermal conductivity of 10.0 W/m-K, is designed for advanced applications requiring maximum heat dissipation. Its robust density and electrical insulation properties make it a great fit for industrial and automotive systems with high heat output.
GFTP-1200 features a thermal conductivity of 12.0 W/m-K, making it highly suitable for high-power electronics, such as power supplies and converters. Its flexibility allows it to fill gaps effectively, providing superior thermal management in compact spaces.
GFTP-1500 provides the highest thermal conductivity in the range, at 15.0 W/m-K. It is engineered for the most demanding thermal management applications, such as high-power industrial electronics and advanced automotive systems, where heat management is paramount.