Deep Material's potting materials provide robust thermal management solutions, designed to withstand extreme temperatures and conditions. These products offer excellent bonding strength, high thermal conductivity, and electrical insulation, ideal for electronic components in sectors like automotive, networking equipment, and industrial machinery.
Potting materials are used to protect electronic components from moisture, dust, and other environmental hazards. Deep Material offers a variety of potting materials that provide thermal conductivity, electrical insulation, and mechanical strength, ideal for high-performance applications across multiple industries.
| Property | TPGF-BD-100 | PT-150 | PT-200 | PT-300 | Testing Method |
|---|---|---|---|---|---|
| Color | Light Yellow/White | Gray/White | Gray/White | Black/White | Visual |
| Mixing Ratio | 1:1 | 1:1 | 1:1 | 1:1 | - |
| Viscosity (cps) | 100,000 | 5,000 | 8,000 | 15,000 | ASTM D2196 |
| Density (g/cc) | 1.8 | 2.4 | 2.8 | 3.0 | ASTM D792 |
| Hardness (shore C) | 65 | 65 | 65 | 65 | ASTM D2240 |
| Operation Temperature (°C) | -50~200 | -50~200 | -50~200 | -50~200 | - |
| Tensile Strength (MPa) | 3 | 1.3 | 0.9 | 0.6 | ASTM D638 |
| Shear Strength (MPa) | 1.7 | - | - | - | ASTM D638 |
| Electrical Parameters | |||||
| Breakdown Voltage (Kv/mm) | >8.0 | >8.0 | >8.0 | >8.0 | ASTM D149 |
| Volume Resistance (Ω.cm) | 1013 | 1013 | 1013 | 1013 | ASTM D257 |
| Flammability Rating | V-0 | V-0 | V-0 | V-0 | UL 94 |
| Thermal Performance | |||||
| Thermal Conductivity (W/m-K) | 1.0 | 1.5 | 2.0 | 3.0 | ASTM D5470 |
| Curing Parameters | |||||
| Operation Time@ 25℃ (Hrs) | 1 | 1 | 1 | 1 | - |
| Curing Time@ 25℃ (Hrs) | 4 | 4 | 4 | 4 | - |
| Curing Time@ 150℃ (min) | 30 | 10 | 10 | 10 | - |
| Special Properties | High Bonding | High Flow | High Flow | - | - |
TPGF-BD-100 is designed for high bonding applications, with a thermal conductivity of 1.0 W/m·K. Its high viscosity (100,000 cps) makes it suitable for potting applications requiring a strong bond, such as in automotive electronics and power supply units. This product provides strong mechanical protection while maintaining thermal performance.
Best For: Applications requiring strong mechanical bonding and thermal management.
PT-150 is a high-flow potting material with a thermal conductivity of 1.5 W/m·K. Its low viscosity (5,000 cps) makes it ideal for applications where coverage and flow are critical, such as in industrial control systems and telecommunications equipment. This product offers fast curing, making it a great choice for high-volume manufacturing.
Best For: High-flow applications and large coverage areas with moderate thermal demands.
PT-200 offers increased thermal conductivity (2.0 W/m·K) for applications where heat dissipation is critical. Its moderate viscosity (8,000 cps) allows it to be easily applied in automotive electronics, power electronics, and LED lighting systems, where both thermal management and electrical insulation are crucial.
Best For: Applications requiring a balance between flowability and enhanced thermal conductivity.
PT-300 is a high-performance potting material with the highest thermal conductivity in the range (3.0 W/m·K). It is specifically designed for use in extreme conditions where excellent heat dissipation is required, such as in power supply units, industrial control systems, and telecommunications equipment.
Best For: Harsh environments requiring maximum heat dissipation and electrical insulation.