Single Part Liquid Gap Filler Products

Deep Material's advanced single-part liquid gap fillers provide superior thermal management solutions for electronics in various applications.

Single part liquid gap fillers are thermally conductive materials designed to fill air gaps between components, ensuring optimal thermal transfer. At Deep Material, we specialize in high-performance gap fillers that help combat overheating in electronic devices, enhancing their reliability and performance.

Applications

Tips for Using Single Part Liquid Gap Fillers

Product Specifications

Parameters TCG-Gel-2000-LP TCG-Gel-2000RW TCG-Gel-4000 TCG-Gel-4000-LP TCG-Gel-5000-HF TCG-Gel-7000 TCG-Gel-10000 Testing Method
Color White Light Yellow Green Yellow Blue Grey Red Visual
Minimum BLT (mm) 0.06 0.15 0.06 0.15 0.10 0.10 0.12 -
Density (g/cc) 1.7 2.7 3.25 1.6 3.20 3.37 3.50 ASTM D792
Specific Heat Capacity (J/g·K) 1.1 1.1 1.1 1.1 1.1 1.1 1.1 ASTM E1269
Flow Rate (g/min) 40 > 200 18 40 40 12 10 30cc tube, 90psi air pressure
Volatility (%) <0.01 <0.05 <0.01 <0.05 <0.01 <0.01 <0.01 ASTM E595
Operation Temperature (°C) -50~200 -50~200 -50~200 -50~200 -50~200 -50~200 -50~200 -
Electrical Parameters
Breakdown Voltage (Kv/mm) >8.0 >8.0 >8.0 >8.0 >8.0 >8.0 >8.0 ASTM D149
Volume Resistance (Ω·cm) 1014 1013 1013 1014 1013 1013 1013 ASTM D257
Dielectric Constant (1GHz) 3.7 5.1 7.5 3.9 7.5 8.0 9.8 ASTM D150
Flammability Rating V-0 V-0 V-0 V-0 V-0 V-0 V-0 UL 94
Thermal Parameters
Thermal Conductivity (W/m-K) 2.0 2.0 4.0 4.0 5.0 7.0 10.0 ASTM D5470

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Detailed Product Explanations and Applications


TCG-Gel-2000-LP

Overview: The TCG-Gel-2000-LP is a white, low-viscosity liquid gap filler specifically designed for applications requiring minimal bond line thickness. It is ideal for thermal interface management in electronic devices.

Applications:

  • Consumer Electronics: Used in smartphones and tablets for effective heat dissipation.
  • SSDs: Helps maintain optimal temperatures in solid-state drives, enhancing performance and longevity.
  • Radios: Ensures reliable operation in RF applications by efficiently transferring heat.

Key Features:

  • Thermal Conductivity: 2.0 W/m-K
  • Density: 1.7 g/cc
  • Operating Temperature: -50°C to 200°C

TCG-Gel-2000RW

Overview: This light yellow liquid gap filler offers a balance of high thermal conductivity and low pressure requirements. It is formulated to cure rapidly and provides a robust thermal interface.

Applications:

  • Consumer Electronics: Perfect for devices where weight and space are critical.
  • SSDs: Enhances the thermal performance of storage devices.
  • Radios: Suitable for RF devices needing efficient heat management.

Key Features:

  • Thermal Conductivity: 2.0 W/m-K
  • Flow Rate: Greater than 200 g/min
  • Density: 2.7 g/cc

TCG-Gel-4000

Overview: The TCG-Gel-4000 is a green liquid gap filler designed for moderate pressure applications. Its unique formulation allows it to fill gaps effectively, ensuring maximum thermal efficiency.

Applications:

  • Consumer Electronics: Used in laptops and high-performance PCs to manage thermal loads.
  • SSDs: Improves the heat dissipation of high-capacity drives.
  • Radios: Essential for maintaining signal integrity by managing temperature.

Key Features:

  • Thermal Conductivity: 4.0 W/m-K
  • Density: 3.25 g/cc
  • Operating Temperature: -50°C to 200°C

TCG-Gel-4000-LP

Overview: The TCG-Gel-4000-LP, characterized by its yellow color, is designed for applications that require low bond line thickness and efficient thermal performance.

Applications:

  • Consumer Electronics: Suitable for high-density packaging in smartphones and tablets.
  • SSDs: Ensures optimal heat management in solid-state devices.
  • Radios: Provides thermal stability in RF applications.

Key Features:

  • Thermal Conductivity: 4.0 W/m-K
  • Flow Rate: 40 g/min
  • Density: 1.6 g/cc

TCG-Gel-5000-HF

Overview: This blue liquid gap filler offers high thermal conductivity and excellent flow properties. It is formulated to cure in situ, ensuring strong adhesion and efficient thermal management.

Applications:

  • Consumer Electronics: Ideal for gaming consoles and PCs requiring high-performance cooling.
  • SSDs: Effective in high-speed storage solutions where heat management is critical.
  • Radios: Used in RF amplifiers and other devices needing stable temperature control.

Key Features:

  • Thermal Conductivity: 5.0 W/m-K
  • Density: 3.20 g/cc
  • Operating Temperature: -50°C to 200°C

TCG-Gel-7000

Overview: The TCG-Gel-7000 is a grey liquid gap filler designed for applications that require enhanced thermal performance without high mechanical support.

Applications:

  • Consumer Electronics: Used in mobile devices and laptops for efficient thermal management.
  • SSDs: Ideal for high-capacity drives that generate significant heat.
  • Radios: Maintains signal integrity by managing heat.

Key Features:

  • Thermal Conductivity: 7.0 W/m-K
  • Density: 3.37 g/cc
  • Operating Temperature: -50°C to 200°C

TCG-Gel-10000

Overview: The TCG-Gel-10000 is a red liquid gap filler known for its high thermal conductivity and strong adhesion properties. It is suitable for demanding applications that require superior thermal performance.

Applications:

  • Consumer Electronics: Ideal for high-end devices needing excellent heat management.
  • SSDs: Ensures optimal thermal management in high-performance storage solutions.
  • Radios: Essential for maintaining reliable operation in RF applications.

Key Features:

  • Thermal Conductivity: 10.0 W/m-K
  • Density: 3.50 g/cc
  • Operating Temperature: -50°C to 200°C