The Special Gap Pad series offers low density and low dielectric properties, making them ideal for thermal management in various applications. These pads are specifically designed to provide excellent thermal performance while ensuring electrical insulation.
The Special Gap Pad series offers low density and low dielectric properties, making them ideal for thermal management in various applications. These pads are specifically designed to provide excellent thermal performance while ensuring electrical insulation.
| Property | GFTP-200 LD | GFTP-300 LD | GFTP-300LP | Testing Method |
|---|---|---|---|---|
| Color | Grey | Yellow | Yellow | Visual |
| Thickness (mm) | 0.5~5.0 | 0.5~5.0 | 0.5~5.0 | - |
| Density (g/cc) | 2.0 | 2.3 | 1.6 | ASTM D792 |
| Hardness (Shore 00) | 30-50 | 40-70 | 20-70 | ASTM D2240 |
| Operation Temp (°C) | -50 to 150 | -50 to 150 | -50 to 150 | - |
| Electrical Parameters | ||||
| Dielectric Constant @ 1GHz | 5.5 | 7.3 | 3.8 | ASTM D150 |
| Volume Resistance (Ω.cm) | 10^14 | 10^14 | 10^14 | ASTM D257 |
| Breakdown Voltage (KV/mm) | >10 | >10 | >10 | ASTM D149 |
| Flammability Rating | V-0 | V-0 | V-0 | UL 94 |
| Thermal Performance | ||||
| Thermal Conductivity (W/m-K) | 2.0 | 3.0 | 3.0 | ASTM D5470 |
Overview: GFTP-200 LD is a grey pad that offers low density and excellent thermal conductivity of 2.0 W/m·K. It features a hardness rating of 30-50 Shore 00, making it suitable for various thermal management applications.
Differences: Compared to other pads, GFTP-200 LD has a lower thermal conductivity, making it more suitable for less demanding applications.
Applications: Ideal for consumer electronics and lightweight devices where thermal performance is needed without the bulk.
Tips: Ensure the surface is clean and dry before application. Use this pad in environments where high thermal dissipation is required.
Overview: GFTP-300 LD is a yellow pad designed for high thermal performance with a thermal conductivity of 3.0 W/m·K. It has a hardness rating of 40-70 Shore 00, making it versatile for various industrial applications.
Differences: This pad offers better thermal conductivity than GFTP-200 LD, making it suitable for applications requiring more efficient heat dissipation.
Applications: Recommended for automotive and computing applications where heat management is critical.
Tips: Choose this pad for applications where the temperature may fluctuate significantly. Ensure proper alignment during installation for optimal performance.
Overview: GFTP-300LP is another yellow pad that offers a lower density of 1.6 g/cc, maintaining a thermal conductivity of 3.0 W/m·K. This pad is ideal for compact electronic devices.
Differences: Compared to GFTP-300 LD, GFTP-300LP has a significantly lower density, making it lighter and easier to apply in tight spaces.
Applications: Suitable for SSDs, memory modules, and networking devices where space is a constraint but thermal performance is still crucial.
Tips: Use in scenarios where minimizing weight is essential. Apply with care to avoid air pockets that could reduce thermal efficiency.