Deep Material's advanced two-part liquid gap fillers for efficient heat dissipation in a range of electronic applications.
Two-part liquid gap fillers are designed for filling larger gaps and voids where heat needs to be conducted efficiently away from heat-generating components. These materials are mixed and cured in place, creating a robust thermal interface.
| Parameters | TPGF-180-LD | TPGF-200 | TPGF-200LP-RW | TPGF-300-RW | TPGF-350 | TPGF-500 | Testing Method | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Color A/B | Red/White | Yellow/White | Pink/White | Yellow/White | Blue/White | Green/White | Visual | |||||||
| Mixing Ratio | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 | - | |||||||
| Viscosity (cps) | 150,000 | 170,000 | 250,000 | 270,000 | 250,000 | 280,000 | ASTM D2196 | |||||||
| Density (g/cc) | 1.8 | 2.5 | 1.8 | 3.0 | 3.2 | 3.3 | ASTM D792 | |||||||
| Hardness (shore 00, after fully cured) | 50 | 45 | 50 | 45 | 50 | 60 | ASTM D2240 | |||||||
| Volatility (%) | <0.01 | <0.01 | <0.01 | <0.01 | <0.01 | <0.01 | ASTM E595 | |||||||
| Operation Temperature (°C) | -50~150 | -50~200 | -50~200 | -50~200 | -50~200 | -50~200 | - | |||||||
| Electrical Parameters | ||||||||||||||
| Breakdown Voltage (Kv/mm) | >6.0 | >8.0 | >8.0 | >8.0 | >8.0 | >8.0 | ASTM D149 | |||||||
| Dielectric Constant (1GHz) | 7.0 | 6.8 | 3.7 | 7.5 | 7.5 | 8.0 | ASTM D150 | |||||||
| Volume Resistance (Ω·cm) | 1013 | 1013 | 1013 | 1013 | 1013 | 1013 | ASTM D257 | |||||||
| Thermal Performance | ||||||||||||||
| Thermal Conductivity (W/m·K) | 1.8 | 2.0 | 2.0 | 3.0 | 3.5 | 5.0 | ASTM D5470 | |||||||
| Curing Parameters | ||||||||||||||
| Operation Time @ 25℃ (min) | 120 | 120 | 120 | 120 | 120 | 120 | - | |||||||
| Curing Time @ 25℃ (Hrs) | 24 | 24 | 24 | 24 | 24 | 24 | - | |||||||
| Curing Time @ 100℃ (min) | 10 | 10 | 10 | 10 | 10 | 10 | - | |||||||
| Special Properties | - | - | Easy peel without residue (reworkable) | - | - | - | ||||||||
TPGF-180-LD is a low-density two-part liquid gap filler. It is designed for applications requiring a lower thermal conductivity of 1.8 W/m-K and excellent flexibility, with a hardness of 50 Shore 00 after curing. It performs well in operating temperatures ranging from -50°C to 150°C, making it ideal for various electronic systems.
TPGF-200 offers a slightly higher thermal conductivity of 2.0 W/m-K and operates across a wider temperature range of -50°C to 200°C. Its ease of use and flexibility make it perfect for power modules and automotive electronics where higher thermal performance is needed.
TPGF-200LP-RW is a reworkable liquid gap filler with easy-peel properties. This unique feature allows for simple removal without leaving residue, making it ideal for applications where maintenance or part replacement is required. It provides a thermal conductivity of 2.0 W/m-K.
With a thermal conductivity of 3.0 W/m-K, TPGF-300-RW is suitable for more demanding thermal management applications. Its reworkable property, along with a high dielectric constant, ensures that it performs well in electronics systems that require periodic servicing.
TPGF-350 is designed for high-performance systems requiring a thermal conductivity of 3.5 W/m-K. Its robust thermal performance ensures long-term reliability in harsh conditions, making it ideal for high-power devices and automotive electronics.
TPGF-500 is a high-performance liquid gap filler with the highest thermal conductivity of 5.0 W/m-K in the range. It is well-suited for advanced power modules, electric vehicles, and high-heat-producing industrial equipment where efficient heat dissipation is critical.