High Conductivity Adhesive Tape
High Conductivity Adhesive tapes designed to provide efficient heat transfer and reliable bonding between heat-generating components and heat sinks. HCA materials combine thermally conductive, electrically insulating fillers with a low-modulus, silicone-free, low-oil-bleed formulation for clean adhesive-based thermal interfaces.
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Applications
Bonding heat sinks to power devices and processorsConsumer and computing electronics, including SSDsPower electronics modules requiring electrical isolationAutomotive and industrial electronicsLow-stress adhesive-based thermal interface solutions
Common Specifications
Minimum BLT
40 µm
Dielectric Strength
>8 kV/mm
Operating Temperature
-50°C to 120°C
Volatility
<0.01%
Flammability
V-0 (UL 94)
Storage
10°C to 30°C in a dry environment
Shelf Life
12 months from date of manufacture
Packaging
Sheet form or die-cut to customer-specified dimensions and thicknesses
Product Variants
| Model | Color | Thermal Conductivity | Density | Dielectric Constant @ 1 GHz | Viscosity @ 60°C | Shear Strength @ 25°C |
|---|---|---|---|---|---|---|
| HCA-5000 | White | 5.0 W/m·K | 3.3 +/- 0.1 g/cc | 8 | 1000 +/- 200 Pa·s | 0.3 MPa |
| HCA-4000 | White | 4.0 W/m·K | 3.25 +/- 0.1 g/cc | 7.5 | 900 +/- 200 Pa·s | 0.3 MPa |
| HCA-2000 | White | 2.0 W/m·K | 2.8 +/- 0.1 g/cc | 6.0 | 800 +/- 200 Pa·s | 0.7 MPa |