Our Products

Explore our 100+ thermal interface materials engineered for reliable heat transfer in high-performance electronic systems.

Low Bondline Thickness

FlexiMetal^®

Up to 35 W/mK materials with minimal bond line thickness for the most demanding thermal interface applications. FlexiMetal is available in foils for hand placement or in bulk for screen printing. FlexiMetal has all the advantages of liquid metal but without any of its drawbacks. Extensive performance and reliability data is available upon request.

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PCM

PCM is up to 9.6 W/m·K phase change material supplied solid for simplified handling and assembly, which transitions near 50°C to improve surface wetting, reduce thermal impedance, and limit pump-out/migration for long-term reliability.

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Thermal Grease

High-performance thermal grease for heat transfer between heat-generating components and heat sinks in modern electronics.

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Gap Fillers

Single Part Liquid Gap Filler

Thermally conductive gap fillers for reliable heat transfer in compact devices. Available in low-oil-bleed, low-outgassing, high-flow, low-permittivity, and EMI-absorbing variants. Compatible with automated dispensing systems.

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Two Parts Liquid Gap Filler

Thermally conductive two-part gap fillers for efficient heat dissipation in demanding electronic assemblies. Available in ultra-thin bond-line, low-resistivity, EMI-absorbing, low-density, reworkable, and glass-bead-controlled variants. Compatible with automated dispensing systems. Custom formulations available.

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Gap Pads

Soft, conformable thermal pads designed to bridge gaps between electronic components and heat sinks with uniform heat transfer.

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Specialty Gap Pads

Specially-formulated thermal gap pads for applications that require more than standard thermal conductivity. Deep Materials offers a broad specialty gap pad portfolio, including high-rebound gap pads for improved contact recovery, low-oil-seepage gap pads for cleaner long-term reliability, low-density gap pads for weight-sensitive designs, low-dielectric gap pads for signal-sensitive applications, Zero Pad materials with extremely low hardness, ultra-soft gap pads for low-stress compression, and standard gap pads for general thermal management. These materials help engineers balance thermal performance with mechanical compliance, electrical behavior, reworkability, reliability, and assembly constraints across complex electronic systems.

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Low Oil Bleed Pads

Low-oil-bleed thermal interface pads engineered for controlled conformal flow under compression, improving surface wet-out and gap filling while minimizing silicone oil migration.

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Insulating Pads

Thermal and electrical insulation pads with low thermal resistance for critical electronic applications.

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Low Oil Bleed Pads

Low Oil Bleed Gels

Low-oil-bleed single-part thermal gels engineered for automated dispensing, stable thermal contact, and reliable heat dissipation across variable gap tolerances.

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Potting Materials

Encapsulation materials with thermal conductivity and mechanical protection for automotive, industrial, and networking applications.

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High Conductivity Adhesive Tape

High Conductivity Adhesive tapes designed to provide efficient heat transfer and reliable bonding between heat-generating components and heat sinks. HCA materials combine thermally conductive, electrically insulating fillers with a low-modulus, silicone-free, low-oil-bleed formulation for clean adhesive-based thermal interfaces.

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Our Products

FlexiMetal®

PCM

Thermal Grease

Single Part Liquid Gap Filler

Two Parts Liquid Gap Filler

Gap Pads

Specialty Gap Pads

Low Oil Bleed Pads

Insulating Pads

Low Oil Bleed Gels

Potting Materials

High Conductivity Adhesive Tape

FlexiMetal^®