Potting Materials
Encapsulation materials with thermal conductivity and mechanical protection for automotive, industrial, and networking applications.
Applications
AutomotiveIndustrialNetworkingPower electronics
Common Specifications
Mixing Ratio
1:1
Operating Temperature
-50°C to 200°C
Hardness
65 Shore C
Breakdown Voltage
>8.0 kV/mm
Flammability
V-0 (UL 94)
Curing Time @ 25°C
4 hours
Product Variants
| Model | Thermal Conductivity | Viscosity | Tensile Strength |
|---|---|---|---|
| TPGF-BD-100 | 1.0 W/m·K | 100,000 cps | 3 MPa |
| PT-150 | 1.5 W/m·K | 5,000 cps | 1.3 MPa |
| PT-200 | 2.0 W/m·K | 8,000 cps | 0.9 MPa |
| PT-300 | 3.0 W/m·K | 15,000 cps | 0.6 MPa |